HP-160
The SAWATEC HP-160 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The temperature range is designed as standard up to 250° C. The HP-160 offers high uniformity and process repeatability and can be used for substrates up to 150mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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Hotplate HP-160-700
The Challenge
Designing a hotplate for high temperature processes, with a very wide temperature range (20 °C to 700 °C) and and a hig uniformity of temperature (+ / - 5 °C).
HP-160-700 - the solution of SAWATEC AG
The Hotplate HP-160-700 was especially designed for high temperature processes in the semiconductor industry. It provides a very high accurary of temperature
By interest please directly contact our dealers or the SAWATEC-sales-department (sales@sawatec.com).
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SBM-500
The SAWATEC SBM-500 soft bake module has been developed for standard soft bake processes in lithography and similar applications. The temperature range is designed as standard up to 150° C. The soft bake module offers high uniformity and process repeatability and can be used for substrates up to 300mm or 9 x 100mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability.
More information about SBM-500