HP-150
The SAWATEC HP-150 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The temperature range is designed as standard up to 250° C. The HP-150 offers high uniformity and process repeatability and can be used for substrates up to 150mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with optional expandability (wet bench integration).
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HP-160
The SAWATEC HP-160 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The temperature range is designed as standard up to 250° C. The HP-160 offers high uniformity and process repeatability and can be used for substrates up to 150mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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HP-200
The SAWATEC HP-200 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The temperature range is designed as standard up to 250° C. The HP-200 offers high uniformity and process repeatability and can be used for substrates up to 200mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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HP-401
The SAWATEC HP-401 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The temperature range is designed as standard up to 250° C. The HP-401 offers high uniformity and process repeatability and can be used for substrates up to 300mm.
The hotplate comes as standard with proximity pins and loading pins, allowing simultaneous processing of five substrates (up to 100mm).
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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HP-160-700
The SAWATEC HP-160-700 hotplate is designed for high-temperature process developments. The temperature range is designed as standard up to 700° C. The HP-160-700 offers high uniformity and process repeatability and can be used for substrates up to 140mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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HP-200-Z-HMDS
The SAWATEC HP-200-Z-HMDS hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The multi-zone heating system (9 zones) ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications.
The temperature range is designed as standard up to 350° C. The HP-200-Z-HMDS offers very high uniformity and process repeatability and can be used for substrates up to 200mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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HP-401-Z
The SAWATEC HP-401-Z hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications. The multi-zone heating system (16 zones) ensures very high temperature distribution, which is adjustable for each zone.
The temperature range is designed as standard up to 350° C. The HP-401-Z offers very high uniformity and process repeatability and can be used for substrates up to 300mm.
The hotplate comes as standard with proximity pins and loading pins, allowing simultaneous processing of five substrates (up to 100mm).
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability (wet bench integration).
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SBM-500
The SAWATEC SBM-500 soft bake module has been developed for standard soft bake processes in lithography and similar applications. The temperature range is designed as standard up to 150° C. The soft bake module offers high uniformity and process repeatability and can be used for substrates up to 300mm or 9 x 100mm.
Outstanding features of the hotplate are its robust design and ease of operation. The hotplate’s modular design means that it can be used in a wide range of applications with high optional expandability.
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